Intent: ETP commercial high-conductivity copper vs OFE high-purity oxygen-free copper (<5 ppm O2) for hydrogen atmosphere brazing, glass-to-metal seals, and vacuum electronics.
Material Comparison Engine
Compare verified materials with source-specific conditions, units, and property limits.
| Parameter | C11000 ETP Copper | C10100 Oxygen-Free Electronic (OFE) Copper |
|---|---|---|
| Material Family | Copper Alloys | Copper Alloys |
| Subfamily | Pure Copper | Pure Copper |
| UNS Designation | C11000 | C10100 |
| COMMERCIAL Designation | Electrolytic Tough Pitch | Oxygen-Free Electronic Copper |
| SPECIFICATION Designation | ASTM B187/B187M | ASTM B577 |
| CDA Designation | — | Alloy 101 |
| Element | C11000 ETP Copper | C10100 Oxygen-Free Electronic (OFE) Copper |
|---|---|---|
| Cu (Copper) | ≥ 99.9% | ≥ 99.99% |
| Pb (Lead) | — | ≤ 0.0005% |
| Zn (Zinc) | — | ≤ 0.0001% |
| Fe (Iron) | — | ≤ 0.001% |
| P (Phosphorus) | — | ≤ 0.0003% |
| Ag (Silver) | — | ≤ 0.0025% |
| As (Arsenic) | — | ≤ 0.0005% |
| O (Oxygen) | — | ≤ 0.0005% |
| Sb (Antimony) | — | ≤ 0.0004% |
| Te (Tellurium) | — | ≤ 0.0002% |
| Property | C11000 ETP Copper | C10100 Oxygen-Free Electronic (OFE) Copper |
|---|---|---|
| Density · TYPICAL · 20 °CUnit: g/cm³ | 8.885–8.941 g/cm³ | 8.941 g/cm³ |
| Specific Gravity · TYPICALUnit: — | 8.91 — | — — |
| Mechanical Parameter | C11000 ETP Copper1/2 Hard (H02) | C10100 Oxygen-Free Electronic (OFE) Copper1/2 Hard (H02) |
|---|---|---|
| Modulus of Elasticity in Tension · TYPICALUnit: | 117210.9 MPa | 117.2 GPa |
| Modulus of Rigidity · TYPICALUnit: MPa | 44126.4 MPa | 44126.4 MPa |
| Machinability Rating · TYPICALUnit: % | 20 % | 20 % |
| Forgeability Rating · TYPICALUnit: — | 65 — | 65 — |
| Tensile Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | 289.6 MPa | — MPa |
| Tensile Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | — MPa | 289.6 MPa |
| Elongation · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: % | 14 % | — % |
| Elongation · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: % | — % | 14 % |
| Shear Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | 179.3 MPa | — MPa |
| Fatigue Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | 89.6 MPa | — MPa |
| Fatigue Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICALUnit: MPa | — MPa | 89.6 MPa |
| Yield Strength (0.5% Ext) · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | — MPa | 248.2 MPa |
| Property | C11000 ETP Copper | C10100 Oxygen-Free Electronic (OFE) Copper |
|---|---|---|
| Electrical Conductivity · TYPICAL · 20 °CCategory: ELECTRICAL • Unit: % IACS | 101 % IACS | 101 % IACS |
| Liquidus Temperature · TYPICALCategory: THERMAL • Unit: °C | 1082.8 °C | 1082.8 °C |
| Solidus Temperature · TYPICALCategory: THERMAL • Unit: °C | 1065 °C | 1082.8 °C |
| Thermal Conductivity · TYPICAL · 20 °CCategory: THERMAL • Unit: W/(m·K) | 391.15 W/(m·K) | 391.15 W/(m·K) |
| Coefficient of Thermal Expansion (68-212°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K) | 16.92 µm/(m·K) | 16.92 µm/(m·K) |
| Coefficient of Thermal Expansion (68-392°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K) | 17.28 µm/(m·K) | 17.28 µm/(m·K) |
| Coefficient of Thermal Expansion (68-572°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K) | 17.64 µm/(m·K) | 17.64 µm/(m·K) |
| Specific Heat Capacity · TYPICAL · 20 °CCategory: THERMAL • Unit: J/(kg·K) | 385.2 J/(kg·K) | 385.2 J/(kg·K) |
| Annealing Temperature Range · RANGECategory: THERMAL • Unit: °C | 371.1–648.9 °C | 371.1–648.9 °C |
| Hot Working Temperature Range · RANGECategory: THERMAL • Unit: °C | 760–871.1 °C | 760–871.1 °C |
| Hardness Scale | C11000 ETP Copper | C10100 Oxygen-Free Electronic (OFE) Copper |
|---|---|---|
| Rockwell B Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C | 40 HRB | — |
| Rockwell B Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL | — | 40 HRB |
| Rockwell F Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C | 84 HRF | — |
| Rockwell F Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL | — | 84 HRF |
| Rockwell 30T Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C | 50 HR30T | — |
| Rockwell 30T Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL | — | 50 HR30T |
Machinability: Machinability rating: 20% relative to free-cutting brass (C36000 = 100%). Forgeability rating: 65.
Weldability: Soldering: Excellent; Brazing: Good; Butt Welding: Good; Gas Shielded Arc Welding: Fair; Oxyacetylene Welding, Coated Metal Arc Welding, Spot Welding, and Seam Welding: Not Recommended.
Formability / Cold Working: Capacity for being cold worked: Excellent; Capacity for being hot formed: Excellent.
Heat Treatment & Annealing: Annealing temperature range: 371.1°C to 648.9°C (700°F - 1200°F). Hot working temperature range: 760.0°C to 871.1°C (1400°F - 1600°F).
Machinability: Machinability rating: 20% relative to free-cutting brass (C36000 = 100%). Forgeability rating: 65.
Weldability: Soldering: Excellent; Brazing: Excellent; Oxyacetylene Welding: Fair; Gas Shielded Arc Welding: Good; Coated Metal Arc Welding: Not Recommended; Spot Weld: Not Recommended; Seam Weld: Not Recommended; Butt Weld: Good
Formability / Cold Working: Capacity for Being Cold Worked: Excellent. Capacity for Being Hot Formed: Excellent.
Heat Treatment & Annealing: Annealing temperature range: 371.1°C to 648.9°C (700°F - 1200°F). Hot working temperature range: 760.0°C to 871.1°C (1400°F - 1600°F).