Intent: Selection between high-conductivity electrolytic tough pitch copper and oxygen-free copper for welding and high-temperature brazing operations.
Engineering Verdict & When to Choose Each
ETP or oxygen-free copper: let the thermal process decide
By Mat Grades Editorial Desk · Updated 2026-11-14
For a conventional conductor, begin with the electrical and mechanical requirements instead of assuming that oxygen-free copper is automatically better value. For a component exposed to a reducing joining atmosphere, identify the oxygen-content requirement early and discuss the complete thermal process with the joining supplier.
C11000 and C10200 can both appear in high-conductivity applications, but their chemistry distinction matters in specific processing conditions. The useful comparison is between actual stock forms and tempers, with conductivity requirements stated explicitly. A generic purity percentage does not define the acceptable conductor or joint.
For a brazed electrical block, review the atmosphere, joint design, leak or electrical test and the machining route together. If the process requires oxygen-free material, retain that reason on the drawing. If the part is unjoined busbar, repeat the selection from its actual duty rather than carrying over a premium requirement from a different component.
C11000 ETP Copper: evidence to check
C11000 ETP Copper has 199 cataloged property rows. Electrical Conductivity is reported as 101 % IACS (typical; tested at 20 °C). Modulus of Elasticity in Tension is reported as 117210.9 MPa (typical; further condition not stated). The record identifies ASTM B187/B187M; check its scope and ordered edition. These are source-scoped examples rather than unrestricted design allowables. Read the full row context and certificate before using a value for acceptance; an absent value is not zero or a performance failure.
C10200 Oxygen-Free (OF) Copper: evidence to check
C10200 Oxygen-Free (OF) Copper has 192 cataloged property rows. Electrical Conductivity is reported as 101 % IACS (typical; tested at 20 °C). Modulus of Elasticity (Tension) is reported as 117.2 GPa (typical; further condition not stated). The record identifies ASTM B577; check its scope and ordered edition. These are source-scoped examples rather than unrestricted design allowables. Read the full row context and certificate before using a value for acceptance; an absent value is not zero or a performance failure.
Four questions before approval
- Is the part exposed to a reducing atmosphere during heating?
- Are conductivity and temper acceptance requirements explicit?
- Does the joint have an approved inspection method?
- Is the material premium linked to a documented need?
Check the linked material records for the complete source trail. Read the methodology before comparing minimum requirements with typical measurements. No direct substitution or qualified fabrication procedure is implied.
Material Comparison
Compare verified engineering materials side by side with condition-specific mechanical properties.
| Parameter | C11000 ETP Copper | C10200 Oxygen-Free (OF) Copper |
|---|---|---|
| Material Family | Copper Alloys | Copper Alloys |
| Subfamily | Pure Copper | Pure Copper |
| UNS Designation | C11000 | C10200 |
| COMMERCIAL Designation | Electrolytic Tough Pitch | Oxygen-Free Copper |
| SPECIFICATION Designation | ASTM B187/B187M | ASTM B577 |
| CDA Designation | — | Alloy 102 |
| Element | C11000 ETP Copper | C10200 Oxygen-Free (OF) Copper |
|---|---|---|
| Cu (Copper) | ≥ 99.9% | ≥ 99.95% |
| O (Oxygen) | — | ≤ 0.001% |
| Property | C11000 ETP Copper | C10200 Oxygen-Free (OF) Copper |
|---|---|---|
| Density · TYPICAL · 20 °CUnit: g/cm³ | 8.885–8.941 g/cm³ | 8.941 g/cm³ |
| Specific Gravity · TYPICALUnit: — | 8.91 — | — — |
| Mechanical Parameter | C11000 ETP Copper1/2 Hard (H02) | C10200 Oxygen-Free (OF) Copper1/2 Hard (H02) |
|---|---|---|
| Modulus of Elasticity in Tension · TYPICALUnit: | 117210.9 MPa | 117.2 GPa |
| Modulus of Rigidity · TYPICALUnit: MPa | 44126.4 MPa | 44126.4 MPa |
| Machinability Rating · TYPICALUnit: % | 20 % | 20 % |
| Forgeability Rating · TYPICALUnit: — | 65 — | 65 — |
| Tensile Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | 289.6 MPa | — MPa |
| Tensile Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | — MPa | 289.6 MPa |
| Elongation · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: % | 14 % | — % |
| Elongation · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: % | — % | 14 % |
| Shear Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | 179.3 MPa | — MPa |
| Shear Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICALUnit: MPa | — MPa | 179.3 MPa |
| Fatigue Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | 89.6 MPa | — MPa |
| Fatigue Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICALUnit: MPa | — MPa | 89.6 MPa |
| Yield Strength (0.5% Ext) · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa | — MPa | 248.2 MPa |
| Property | C11000 ETP Copper | C10200 Oxygen-Free (OF) Copper |
|---|---|---|
| Electrical Conductivity · TYPICAL · 20 °CCategory: ELECTRICAL • Unit: % IACS | 101 % IACS | 101 % IACS |
| Liquidus Temperature · TYPICALCategory: THERMAL • Unit: °C | 1082.8 °C | 1082.8 °C |
| Solidus Temperature · TYPICALCategory: THERMAL • Unit: °C | 1065 °C | 1082.8 °C |
| Thermal Conductivity · TYPICAL · 20 °CCategory: THERMAL • Unit: W/(m·K) | 391.15 W/(m·K) | 391.15 W/(m·K) |
| Coefficient of Thermal Expansion (68-212°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K) | 16.92 µm/(m·K) | 16.92 µm/(m·K) |
| Coefficient of Thermal Expansion (68-392°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K) | 17.28 µm/(m·K) | 17.28 µm/(m·K) |
| Coefficient of Thermal Expansion (68-572°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K) | 17.64 µm/(m·K) | 17.64 µm/(m·K) |
| Specific Heat Capacity · TYPICAL · 20 °CCategory: THERMAL • Unit: J/(kg·K) | 385.2 J/(kg·K) | 385.2 J/(kg·K) |
| Annealing Temperature Range · RANGECategory: THERMAL • Unit: °C | 371.1–648.9 °C | 371.1–648.9 °C |
| Hot Working Temperature Range · RANGECategory: THERMAL • Unit: °C | 760–871.1 °C | 760–871.1 °C |
| Hardness Scale | C11000 ETP Copper | C10200 Oxygen-Free (OF) Copper |
|---|---|---|
| Rockwell B Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C | 40 HRB | — |
| Rockwell B Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL | — | 40 HRB |
| Rockwell F Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C | 84 HRF | — |
| Rockwell F Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL | — | 84 HRF |
| Rockwell 30T Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C | 50 HR30T | — |
| Rockwell 30T Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL | — | 50 HR30T |
Machinability: Machinability rating: 20% relative to free-cutting brass (C36000 = 100%). Forgeability rating: 65.
Weldability: Soldering: Excellent; Brazing: Good; Butt Welding: Good; Gas Shielded Arc Welding: Fair; Oxyacetylene Welding, Coated Metal Arc Welding, Spot Welding, and Seam Welding: Not Recommended.
Formability / Cold Working: Capacity for being cold worked: Excellent; Capacity for being hot formed: Excellent.
Heat Treatment & Annealing: Annealing temperature range: 371.1°C to 648.9°C (700°F - 1200°F). Hot working temperature range: 760.0°C to 871.1°C (1400°F - 1600°F).
Machinability: Machinability rating: 20% relative to free-cutting brass (C36000 = 100%). Forgeability rating: 65.
Weldability: Soldering: Excellent; Brazing: Excellent; Oxyacetylene Welding: Fair; Gas Shielded Arc Welding: Good; Coated Metal Arc Welding: Not Recommended; Spot Weld: Not Recommended; Seam Weld: Not Recommended; Butt Weld: Good
Formability / Cold Working: Capacity for Being Cold Worked: Excellent. Capacity for Being Hot Formed: Excellent.
Heat Treatment & Annealing: Annealing temperature range: 371.1°C to 648.9°C (700°F - 1200°F). Hot working temperature range: 760.0°C to 871.1°C (1400°F - 1600°F).