Curated Engineering Evaluation

Intent: Comparative engineering analysis of electrical conductivity (106% vs 101% IACS), thermal conductivity (429 vs 390 W/(m·K)), noble atmospheric corrosion and sulfidation, contact resistance, and volumetric cost trade-offs in high-performance electrical conductors and switchgear contacts.

Engineering Verdict & When to Choose Each

Silver or copper: compare the complete conductor and contact

By Mat Grades Editorial Desk · Updated 2026-11-14

A bulk conductor and an electrical contact are different selection problems. Compare silver and copper using conductivity values at compatible temperatures and in identified conditions, then assess the complete assembly. A small difference in bulk conductivity does not by itself establish a useful reduction in contact resistance, temperature rise or lifecycle cost.

For a conductor bar, include section, cooling, mechanical support and the allowable operating temperature in the design. For a contact surface, include contact force, movement, contamination and the actual atmosphere. A plated surface on a different substrate is a separate product and process; it should not be treated as equivalent to a solid-metal specimen without suitable evidence.

Quote the same finished requirement when comparing material cost. Include fabrication, any surface treatment, inspection and maintenance rather than using commodity price alone. Test the representative assembly under its real electrical and thermal cycle where the consequence of failure warrants it. Retain the material identity and interface specification with the approval so that a change of coating, supplier or joint detail does not silently invalidate the original selection.

Fine Silver 999: evidence to check

Fine Silver 999 has 16 cataloged property rows. Electrical Conductivity is reported as 106 % IACS (typical; tested at 20 °C). Modulus of Elasticity is reported as 76 GPa (typical; further condition not stated). The record identifies ASTM B742 / B742M; check its scope and ordered edition. These are source-scoped examples rather than unrestricted design allowables. Read the full row context and certificate before using a value for acceptance; an absent value is not zero or a performance failure.

C11000 ETP Copper: evidence to check

C11000 ETP Copper has 199 cataloged property rows. Electrical Conductivity is reported as 101 % IACS (typical; tested at 20 °C). Modulus of Elasticity in Tension is reported as 117210.9 MPa (typical; further condition not stated). The record identifies ASTM B187/B187M; check its scope and ordered edition. These are source-scoped examples rather than unrestricted design allowables. Read the full row context and certificate before using a value for acceptance; an absent value is not zero or a performance failure.

Four questions before approval

  • Are compared conductivity values at compatible temperatures?
  • Is the design limited by bulk loss or contact behavior?
  • Does any proposed plating system have its own qualification?
  • Is cost compared through fabrication, inspection and service?

Check the linked material records for the complete source trail. Read the methodology before comparing minimum requirements with typical measurements. No direct substitution or qualified fabrication procedure is implied.

Material Comparison

Compare verified engineering materials side by side with condition-specific mechanical properties.

PDFExcel
Material A (Baseline)
Material B (Comparison)
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Temper & Metallurgical Context Qualification:The selected records contain different or missing source contexts. Values shown in separate rows are not directly matched. Typical and estimated values are not guaranteed minima; matching context alone does not establish interchangeability.
1. Identity, Classification & Standards
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ParameterFine Silver 999C11000 ETP Copper
Material FamilySilver & Silver AlloysCopper Alloys
SubfamilyFine SilverPure Copper
UNS DesignationP07010C11000
ISO DesignationAg99.9—
ASTM DesignationGrade 99.90—
DIN DesignationAg99.9—
W-Nr Designation2.1211—
UK-HALLMARK Designation999—
SPECIFICATION DesignationASTM B742 Standard Specification for Fine Silver Contact MaterialASTM B187/B187M
COMMERCIAL Designation—Electrolytic Tough Pitch
2. Chemical Composition Limits (wt %)Source-specific limits and typical values
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ElementFine Silver 999C11000 ETP Copper
Ag (Silver)≥ 99.9%—
Cu (Copper)≤ 0.08%≥ 99.9%
Fe (Iron)≤ 0.01%—
Pb (Lead)≤ 0.015%—
Bi (Bismuth)≤ 0.005%—
3. Physical Properties
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PropertyFine Silver 999C11000 ETP Copper
Density · TYPICAL · 20 °CUnit: g/cm³10.49 g/cm³8.885–8.941 g/cm³
Specific Gravity · TYPICALUnit: —— —8.91 —
4. Contextual Mechanical PropertiesUnit: SI
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Mechanical ParameterFine Silver 999Annealed (Soft)C11000 ETP Copper1/2 Hard (H02)
Modulus of Elasticity · TYPICALUnit: 76 GPa 117210.9 MPa
Poisson's Ratio · TYPICALUnit: dimensionless0.37 dimensionless— dimensionless
Yield Strength (0.2% Offset) · Strip, Sheet, Wire, Bar · Annealed (Soft) · TYPICALUnit: MPa≥ 40 MPa— MPa
Ultimate Tensile Strength · Strip, Sheet, Wire, Bar · Annealed (Soft) · TYPICALUnit: MPa≥ 125 MPa— MPa
Tensile Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa— MPa289.6 MPa
Elongation at Break · Strip, Sheet, Wire, Bar · in 50 mm (2 in) · Annealed (Soft) · TYPICALUnit: %≥ 40 %— %
Elongation · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: %— %14 %
Modulus of Rigidity · TYPICALUnit: MPa— MPa44126.4 MPa
Machinability Rating · TYPICALUnit: %— %20 %
Forgeability Rating · TYPICALUnit: —— —65 —
Shear Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa— MPa179.3 MPa
Fatigue Strength · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa— MPa89.6 MPa
5. Electrical & Thermal Conductive Properties
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PropertyFine Silver 999C11000 ETP Copper
Electrical Conductivity · TYPICAL · 20 °CCategory: ELECTRICAL • Unit: % IACS106 % IACS101 % IACS
Electrical Resistivity · TYPICAL · 20 °CCategory: ELECTRICAL • Unit: nΩ·m15.9 nΩ·m— nΩ·m
Thermal Conductivity · TYPICAL · 20 °CCategory: THERMAL • Unit: W/(m·K)429 W/(m·K)391.15 W/(m·K)
Melting Point · TYPICALCategory: THERMAL • Unit: °C962 °C— °C
Specific Heat Capacity · TYPICAL · 20 °CCategory: THERMAL • Unit: J/(kg·K)235 J/(kg·K)385.2 J/(kg·K)
Liquidus Temperature · TYPICALCategory: THERMAL • Unit: °C— °C1082.8 °C
Solidus Temperature · TYPICALCategory: THERMAL • Unit: °C— °C1065 °C
Coefficient of Thermal Expansion (68-212°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K)— µm/(m·K)16.92 µm/(m·K)
Coefficient of Thermal Expansion (68-392°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K)— µm/(m·K)17.28 µm/(m·K)
Coefficient of Thermal Expansion (68-572°F) · TYPICALCategory: THERMAL • Unit: µm/(m·K)— µm/(m·K)17.64 µm/(m·K)
Annealing Temperature Range · RANGECategory: THERMAL • Unit: °C— °C371.1–648.9 °C
Hot Working Temperature Range · RANGECategory: THERMAL • Unit: °C— °C760–871.1 °C
6. Hardness Evaluation (Discrete Scales Preserved)No cross-scale mathematical conversion
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Hardness ScaleFine Silver 999C11000 ETP Copper
HV Hardness · Annealed (Soft) · TYPICAL25–35 HV—
Rockwell B Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C—40 HRB
Rockwell F Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C—84 HRF
Rockwell 30T Hardness · Flat Products · 0.04 in · 1/2 Hard (H02) · TYPICAL · 20 °C—50 HR30T
7. Fabrication & Processing Comparison
Fine Silver 999 Characteristics:

Machinability: Rated at approximately 30% relative to free-cutting brass (C36000). Highly ductile and gummy; produces long continuous chips. Requires sharp high-rake carbide or diamond tooling, light feed rates, and continuous flood coolant to prevent tearing and galling.

Weldability: Weldable with gas tungsten arc (GTAW/TIG) and resistance welding; requires significant preheat and higher heat input due to extremely high thermal diffusivity (1.74 cm²/s). Readily brazed with silver-bearing fluxed fillers.

Formability / Cold Working: Exceptional cold workability. Capable of severe deep drawing, spinning, wire drawing down to micro-diameters, and cold swaging without intermediate annealing.

Heat Treatment & Annealing: Full recrystallization annealing occurs between 200°C and 300°C (392°F to 572°F) for 30 minutes, followed by rapid water quench or air cooling to preserve soft annealed ductility.

C11000 ETP Copper Characteristics:

Machinability: Machinability rating: 20% relative to free-cutting brass (C36000 = 100%). Forgeability rating: 65.

Weldability: Soldering: Excellent; Brazing: Good; Butt Welding: Good; Gas Shielded Arc Welding: Fair; Oxyacetylene Welding, Coated Metal Arc Welding, Spot Welding, and Seam Welding: Not Recommended.

Formability / Cold Working: Capacity for being cold worked: Excellent; Capacity for being hot formed: Excellent.

Heat Treatment & Annealing: Annealing temperature range: 371.1°C to 648.9°C (700°F - 1200°F). Hot working temperature range: 760.0°C to 871.1°C (1400°F - 1600°F).