MAT GRADES — 105 VERIFIED MATERIALS • 100% ITEM-LEVEL PROVENANCE

Material Comparison Engine

Compare verified materials with source-specific conditions, units, and property limits.

Material A (Baseline)
Material B (Comparison)
1. Identity, Classification & Standards
ParameterC12000 DLP CopperC10300 Oxygen-Free Extra Low Phosphorus (OFXLP) Copper
Material FamilyCopper AlloysCopper Alloys
SubfamilyDeoxidized CopperDeoxidized Copper
UNS DesignationC12000C10300
COMMERCIAL DesignationDeoxidized Low Phosphorus CopperOxygen-Free Extra Low Phosphorus Copper
CDA DesignationAlloy 120Alloy 103
SPECIFICATION DesignationASTM B224ASTM B577
2. Chemical Composition Limits (wt %)Source-specific limits and typical values
ElementC12000 DLP CopperC10300 Oxygen-Free Extra Low Phosphorus (OFXLP) Copper
Cu (Copper)≥ 99.9%≥ 99.95%
P (Phosphorus)0.004 – 0.012%0.001 – 0.005%
3. Physical Properties
PropertyC12000 DLP CopperC10300 Oxygen-Free Extra Low Phosphorus (OFXLP) Copper
Density · TYPICAL · 20 °CUnit: g/cm³8.941 g/cm³8.941 g/cm³
4. Contextual Mechanical PropertiesUnit: SI
Mechanical ParameterC12000 DLP Copper1/2 Hard (H02)C10300 Oxygen-Free Extra Low Phosphorus (OFXLP) Copper1/2 Hard (H02)
Modulus of Elasticity (Tension) · TYPICALUnit: GPa117.2 GPa117.2 GPa
Modulus of Rigidity · TYPICALUnit: MPa44126.4 MPa44126.4 MPa
Machinability Rating · TYPICALUnit: %20 %20 %
Forgeability Rating · TYPICALUnit: —65 —65 —
Tensile Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa289.6 MPa289.6 MPa
Yield Strength (0.5% Ext) · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: MPa248.2 MPa248.2 MPa
Elongation · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL · 20 °CUnit: %14 %14 %
Shear Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICALUnit: MPa179.3 MPa179.3 MPa
Fatigue Strength · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICALUnit: MPa89.6 MPa89.6 MPa
5. Electrical & Thermal Conductive Properties
PropertyC12000 DLP CopperC10300 Oxygen-Free Extra Low Phosphorus (OFXLP) Copper
Electrical Conductivity · TYPICAL · 20 °CCategory: ELECTRICAL • Unit: % IACS98 % IACS99 % IACS
Liquidus Temperature · TYPICALCategory: THERMAL • Unit: °C1082.8 °C1082.8 °C
Solidus Temperature · TYPICALCategory: THERMAL • Unit: °C1082.8 °C1082.8 °C
Thermal Conductivity · TYPICAL · 20 °CCategory: THERMAL • Unit: W/(m·K)385.95 W/(m·K)385.95 W/(m·K)
Coefficient of Thermal Expansion (CTE) · TYPICALCategory: THERMAL • Unit: µm/(m·K)16.92 µm/(m·K)16.92 µm/(m·K)
Coefficient of Thermal Expansion (CTE) · TYPICALCategory: THERMAL • Unit: µm/(m·K)17.28 µm/(m·K)17.28 µm/(m·K)
Coefficient of Thermal Expansion (CTE) · TYPICALCategory: THERMAL • Unit: µm/(m·K)17.64 µm/(m·K)17.64 µm/(m·K)
Specific Heat Capacity · TYPICAL · 20 °CCategory: THERMAL • Unit: J/(kg·K)385.2 J/(kg·K)385.2 J/(kg·K)
Annealing Temperature Range · RANGECategory: THERMAL • Unit: °C371.1–648.9 °C371.1–648.9 °C
Hot Working Temperature Range · RANGECategory: THERMAL • Unit: °C760–871.1 °C760–871.1 °C
6. Hardness Evaluation (Discrete Scales Preserved)No cross-scale mathematical conversion
Hardness ScaleC12000 DLP CopperC10300 Oxygen-Free Extra Low Phosphorus (OFXLP) Copper
Rockwell B Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL40 HRB40 HRB
Rockwell F Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL84 HRF84 HRF
Rockwell 30T Hardness · Flat Products · 0.04 · 1/2 Hard (H02) · TYPICAL50 HR30T50 HR30T
7. Fabrication & Processing Comparison
C12000 DLP Copper Characteristics:

Machinability: Machinability rating: 20% relative to free-cutting brass (C36000 = 100%). Forgeability rating: 65.

Weldability: Soldering: Excellent; Brazing: Excellent; Oxyacetylene Welding: Fair; Gas Shielded Arc Welding: Excellent; Coated Metal Arc Welding: Not Recommended; Spot Weld: Not Recommended; Seam Weld: Not Recommended; Butt Weld: Good

Formability / Cold Working: Capacity for Being Cold Worked: Excellent. Capacity for Being Hot Formed: Excellent.

Heat Treatment & Annealing: Annealing temperature range: 371.1°C to 648.9°C (700°F - 1200°F). Hot working temperature range: 760.0°C to 871.1°C (1400°F - 1600°F).

C10300 Oxygen-Free Extra Low Phosphorus (OFXLP) Copper Characteristics:

Machinability: Machinability rating: 20% relative to free-cutting brass (C36000 = 100%). Forgeability rating: 65.

Weldability: Soldering: Excellent; Brazing: Excellent; Oxyacetylene Welding: Fair; Gas Shielded Arc Welding: Excellent; Coated Metal Arc Welding: Not Recommended; Spot Weld: Not Recommended; Seam Weld: Not Recommended; Butt Weld: Good

Formability / Cold Working: Capacity for Being Cold Worked: Excellent. Capacity for Being Hot Formed: Excellent.

Heat Treatment & Annealing: Annealing temperature range: 371.1°C to 648.9°C (700°F - 1200°F). Hot working temperature range: 760.0°C to 871.1°C (1400°F - 1600°F).